Modified phenolic resin, epoxy resin and curing agent molding ma

Details Modified phenolic resin, epoxy resin and curing agent molding ma Modified phenolic resin, epoxy resin and curing agent molding ma

1995-04-06

1996-01-16

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525485, 525488, 525423, C08L 6110, C08L 6302, C08L 6304

Patent

active

054848547

ABSTRACT:
A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

REFERENCES:
patent: 3301803 (1967-01-01), Schick et al.
patent: 3398107 (1968-08-01), Rowe, Jr. et al.
patent: 4024094 (1977-05-01), Kurata et al.

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