Modified lead frame for reducing wire wash in transfer molding o

Details Modified lead frame for reducing wire wash in transfer molding o Modified lead frame for reducing wire wash in transfer molding o

1991-11-05

1993-03-30

Silbaugh, Jan H.

Metal working

Method of mechanical manufacture

Electrical device making

26427217, 26432812, B29C 4502, B29C 5302

Patent

active

051971836

ABSTRACT:
In a leadframe supporting a semiconductor device, the tiebar adjacent the mold gate is kinked, or cut and bent, to form a baffle shielding bond wires connecting the semiconductor device to the leadframe from damage by a jet of incoming molding compound. Whether kinked or cut/bent, the baffle extends out of the plane of the leadframe so as to be disposed more-or-less directly in front of the gate.

REFERENCES:
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4556896 (1985-12-01), Meddles
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4894704 (1990-01-01), Endo
patent: 4987473 (1991-01-01), Johnson
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
Microelectronics Packaging Handbook, Tummala and Rymaszewski, 1989 Van Nostrand Reinhold pp. 578-591.

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