Modified chip attach process

Details Modified chip attach process Modified chip attach process

2007-10-31

2009-08-25

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S127000, C257SE21503, C257SE21508, C257SE21511, C257SE21499

Reexamination Certificate

active

07579213

ABSTRACT:
A process for assembling a package for a semiconductor device is described. The process includes reducing the stress in an inner dielectric layer during packaging by heating the die and the substrate to a temperature where a solder reflows, dropping to a temperature where a selected epoxy will cure, liquefying the epoxy, adding the liquefied epoxy to the die and substrate, and maintaining the die and substrate at a temperature where the epoxy cures for a selected amount of time.

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