Modified alkyl-terminated encapsulant for semiconductor of epoxy

Details Modified alkyl-terminated encapsulant for semiconductor of epoxy Modified alkyl-terminated encapsulant for semiconductor of epoxy

1996-09-23

1999-12-14

Sellers, Robert E.

Stock material or miscellaneous articles

Composite

Of epoxy ether

525407, 525501, 525504, 525508, 525523, 525533, 528110, B32B 2718, B32B 2726, B32B 2738, C08L 6300

Patent

active

060014830

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention relates to an epoxy resin composition effective for encapsulating a photosemiconductor element, the composition having superior mold releasability and transparency.


BACKGROUND OF THE INVENTION

Heretofore, an epoxy resin composition has been used as a material for encapsulating photosemiconductor elements such as a photodetector or a light emittor in view of superiority in transparency, moisture resistance and heat of such a composition.
However, in spite of superiority in transparency, a conventional epoxy resin composition has the defect that mold releasability drastically deteriorates when forming a photosemiconductor device by transfer molding a photosemiconductor element and an epoxy resin composition in a forming die. For this reason, various kinds of problems are caused. For example, a photosemiconductor device deforms, a package cracks, a photosemiconductor element and an encapsulating resin separate, or gold wires peel off from stress in mold releasing. Such problems are distinctly identified by a variety of life tests for photosemiconductor devices, however, generally such photosemiconductor devices are judged as insufficient before they are subjected to such life tests and treated separately as defectives.
For this reason, heretofore, countermeasures have been studied. For example, there is a method that a conventional mold releasing agent is preliminarily mixed in an epoxy resin composition as an encapsulating material. The addition of some kinds of the mold releasing agent to an epoxy resin composition makes it possible to produce a resin composition superior in transparency which is one of the important properties for a resin composition for encapsulating a photosemiconductor element. However, a resin composition superior both in transparency and mold releasability has not been developed. To the contrary, a resin composition for encapsulating which is superior in mold releasability can be produced by the addition of a mold releasing agent, but, however, causes a problem of deterioration in transparency. Thus, it is a current situation that an epoxy resin composition for encapsulating superior both in transparency and mold releasability has not been obtained.


OBJECT OF THE INVENTION

It is an object of the present invention to provide an epoxy resin composition for encapsulating a photosemiconductor element superior both in mold releasability from a forming die in transfer molding and in transparency.


DISCLOSURE OF THE INVENTION

In order to achieve the object mentioned above, the epoxy resin composition for encapsulating a photosemiconductor element in the present invention comprises the following components (A) to (C): or (2). ##STR1## wherein Y.sub.1 represents --H, --RCOOH, --COR' or --R' wherein R is a bivalent organic group and R' is an alkyl group whose carbon number is not more than 30; accounts for 25 to 95% by weight based on the entire compound. ##STR2## wherein R represents a bivalent organic group, accounts for 25 to 95% by weight based on the entire compound.
Namely, the inventors of the present invention have conducted a series of studies in order to obtain an epoxy resin composition for encapsulating a photosemiconductor element superior in both transparency and mold releasability. As a result of repeated tests by employing a variety of compounds to obtain good releasability without deteriorating transparency, it was found out that by employing at least either a specific compound represented by the general formula (1) or (2) as the component (C), an epoxy resin composition for encapsulating a photosemiconductor which is superior in both transparency and mold releasability can be obtained, thus achieving the present invention.
Particularly, by setting the content of the above component (C) at 0.01 to 15% by weight (just abbreviated to % hereinafter) based on the whole epoxy resin composition for encapsulating a photosemiconductor element so as to a decrease in glass transition temperature or moisture resistance reliability, suf

REFERENCES:
patent: 4210572 (1980-07-01), Herman et al.
patent: 4479887 (1984-10-01), Seibert
patent: 4628080 (1986-12-01), Corley

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