Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1995-11-14
1997-11-11
Gulakowski, Randy
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
525407, 525438, 525452, 525453, 525476, 525504, 528 65, 528 66, 528 73, 528 76, 528 84, 528 85, 528 93, C08G 5900, C08L 7504
Patent
active
056865414
ABSTRACT:
A modified epoxy resin is prepared by mixing an isocyanate terminated urethane prepolymer with an epoxy resin in reactive conditions. The modified epoxy resin has a low internal stress when it is cured due to the flexible backbone of the urethane prepolymer incorporated therein, and has a high glass transition temperature due to a rigid oxazolidone structure formed via the epoxy ring opening with the isocyanate groups, and thus is useful as an electronic encapsulant.
REFERENCES:
patent: 2527590 (1950-10-01), Speier, Jr.
patent: 2931786 (1960-04-01), Clark et al.
patent: 3179622 (1965-04-01), Haluska
patent: 3334110 (1967-08-01), Schramm
patent: 3636133 (1972-01-01), Marvin
patent: 3669920 (1972-06-01), Heggis et al.
patent: 3923747 (1975-12-01), Kolycheck
patent: 3979365 (1976-09-01), Tanaka et al.
patent: 4520144 (1985-05-01), Noren et al.
patent: 4762900 (1988-08-01), Velasco et al.
patent: 4766158 (1988-08-01), Fuzesi et al.
patent: 4766183 (1988-08-01), Rizk et al.
patent: 4786693 (1988-11-01), Hefner, Jr.
patent: 4902767 (1990-02-01), Roitman et al.
patent: 5112932 (1992-05-01), Koenig et al.
Chun-Shan Wang, et al., "Toughening of Epoxy Resins by Modification with Dispersed Acrylate Rubber for Electronic Packaging," J. Of Applied Polymer Science, vol. 50, pp. 477-483 (1993).
Chung-Shan Wang, et al., "Low-Stress Encapsulants by Vinylsiloxane Modification," J. Of Applied Polymer Science, vol. 51, pp. 2047-2055 (1994).
Chun-Shan Wang, et al., "Modification of Epoxy Resins by Hydrosilation for Electronic Encapsulation Application," J. Of Applied Polymer Science, vol. 54, pp. 13-23 (1994).
Chun-Shan Wang, et al., "Aminosiloxane-modified epoxy resins as microelectronic encapsulants," Die Angewandte Mackromolekulare Chemie 224 (1995) 21-32 (Nr. 3857).
Ho Tsung-Han
Wang Chun-Shan
Gulakowski Randy
National Science Council
LandOfFree
Modification of epoxy resins with urethane prepolymer for electr does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Modification of epoxy resins with urethane prepolymer for electr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modification of epoxy resins with urethane prepolymer for electr will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1229991