Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-10-15
1991-10-29
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
2940216, 174261, 228119, 437 8, H05K 302
Patent
active
050603701
ABSTRACT:
A method of improving or modifying a fabricated circuit board having a circuit pattern of board traces etched thereon. First and second locations on the printed circuit board are identified for electrical connection of the two locations for the purpose of modifying the circuit board. A path is then selected from the first location to the second location generally without crossing of etched board traces. A metallic panel is provided and metal is removed from the panel to form a plurality of lay-flat traces in a configuration to match the selected path. Preferably, the lay-flat traces are plated with copper and then tin or solder. An overcoating of an insulating material, such as photo-imageable solder mask, is then applied. One of the lay-flat traces can then be removed from the panel and installed on the board to follow the selected path from the first location to the second location. Annular pads at the opposed ends of the lay-flat trace are soldered to the two locations. The plating of copper and solder may be applied after the application of the insulative overcoating. The method provides a low-visibility, easy-to-install interconnection without jeoparadizing the performance of the printed circuit board.
REFERENCES:
patent: 3762040 (1973-10-01), Burns et al.
patent: 4000054 (1976-12-01), Marcantonio
patent: 4178678 (1979-12-01), Carrillo et al.
patent: 4179322 (1979-12-01), Brown et al.
patent: 4200975 (1980-05-01), Debiec et al.
patent: 4255613 (1981-03-01), Ketchpel
patent: 4259367 (1981-03-01), Dougherty, Jr.
patent: 4438561 (1984-03-01), Mueller
patent: 4601915 (1986-07-01), Allen et al.
patent: 4803544 (1989-02-01), Holzschuh et al.
patent: 4806106 (1989-02-01), Mebane et al.
patent: 4908938 (1990-03-01), Thorwarth et al.
patent: 4918264 (1983-11-01), Thorwarth
E-Z Circuit by Bishop Graphics, Inc.--Printed Circuit Copper Products Technical Manual & Catalog EZ-3001, pp. 2-7.
Marks Walter L.
Scales, Jr. James W.
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