Model-based assist feature placement using inverse imaging...

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle

Reexamination Certificate

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C716S053000, C716S054000, C716S055000

Reexamination Certificate

active

08010913

ABSTRACT:
Some embodiments provide techniques and systems to identify locations in a target mask layout for placing assist features. During operation, an embodiment can determine a spatial sampling frequency to sample the target mask layout, wherein sampling the target mask layout at the spatial sampling frequency prevents spatial aliasing in a gradient of a cost function which is used for computing an inverse mask field. Next, the system can generate a grayscale image by sampling the target mask layout at the spatial sampling frequency. The system can then compute the inverse mask field by iteratively modifying the grayscale image. The system can use the gradient of the cost function to guide the iterative modification process. Next, the system can filter the inverse mask field using a morphological operator, and use the filtered inverse mask field to identify assist feature locations in the target mask layout.

REFERENCES:
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patent: 2007/0198963 (2007-08-01), Granik
patent: 2007/0262947 (2007-11-01), Wang
patent: 2008/0124906 (2008-05-01), Moon
G.M.P Van Kempen et al., “The influence of the background estimation on the superresolution properties of non-linear image restoration algorithms,” In: Proc. SPIE, Three-Dimensional and Multidimensional Microscopy: Image Aquisition and Processing VI, Jan. 1999, vol. 3605, pp. 179-189.

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