MODBUS encapsulated transport interface

Details MODBUS encapsulated transport interface MODBUS encapsulated transport interface

2004-04-15

2009-08-11

Lin, Wen-Tai (Department: 2454)

Electrical computers and digital processing systems: multicomput

Computer-to-computer protocol implementing

C709S227000, C700S001000, C370S395500

Reexamination Certificate

active

07574512

ABSTRACT:
A method for encapsulating HTTP messages within a MODBUS message is described in the present invention. This MODBUS message can be encoded and sent using either MODBUS/TCP or serial MODBUS. Within MODBUS, the encapsulation is built using the MODBUS Encapsulation Interface (MEI). The HTTP message may contain HTML, XML, XHTML, or SGML.

REFERENCES:
patent: 5805442 (1998-09-01), Crater et al.
patent: 5975737 (1999-11-01), Crater et al.
patent: 6005759 (1999-12-01), Hart et al.
patent: 6061603 (2000-05-01), Papadopoulos et al.
patent: 6151625 (2000-11-01), Swales et al.
patent: 6282454 (2001-08-01), Papadopoulos et al.
patent: 6327511 (2001-12-01), Naismith et al.
patent: 6434157 (2002-08-01), Dube et al.
patent: 6484061 (2002-11-01), Papadopoulos et al.
patent: 6792337 (2004-09-01), Blackett et al.
patent: 6813525 (2004-11-01), Reid et al.
patent: 7051143 (2006-05-01), White et al.
patent: 7188003 (2007-03-01), Ransom et al.
patent: 2004/0054829 (2004-03-01), White et al.
patent: 2004/0254648 (2004-12-01), Johnson et al.
Goodman, et al. “TCP/IP message encapsulation in serial protocols,” MODBUS developers' community, Apr. 2003.
ISO, “Introductory element”, ISO TC 184/SC 5 N 11, Sep. 18, 2003.
Internet Engineering Task Force, “Hypertext Transfer Protocol—HTTP/1.1”, RFC 2616, Jun. 1999.
“Modbus Messaging on TCP/IP Implementation Guide”, web page at www.modbus.org, V1.0, May 2002.
“Modbus application protocol”, web page at www.modbus.org, V1.1, Dec. 2002.
“Guide Modbus Serial Line Implementation”, web page at www.modbus.org, v1.0, Nov. 2002.
“Real Time Ethernet Modbus-RTPS”, IEC Publically Available Specification, 65C/xxx/NP, May, 2004.

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