Chemistry of carbon compounds – Miscellaneous organic carbon compounds
Patent
1975-04-14
1977-08-30
Woodberry, Edward M.
Chemistry of carbon compounds
Miscellaneous organic carbon compounds
260 52, 260 57R, C08G 228, C08G 230
Patent
active
040454118
ABSTRACT:
Thermosetting phenol-formaldehyde resins having novel structures and properties are described. In one embodiment, there is provided a novel thermosetting phenol-formaldehyde resin having benzyl ether linkages ortho to the phenolic hydroxyl group and characterized by its infra-red spectrum which exhibits absorption at wave numbers of about 1010 cm.sup.-1, 1060 cm.sup.-1 and 1230 cm.sup.-1. The infra-red spectrum has a particular ratio of absorbance at 1010 cm.sup.-1, measured from a base line drawn between wave numbers of 1030 cm.sup.-1 and 950 cm.sup.-1, to that at 1230 cm.sup.-1, measured from a base line drawn between wave numbers of 1130 cm.sup.-1 and 1310 cm.sup.-1 which is less than about 0.1. These novel resins are prepared by the controlled addition of strong acids to thermosetting phenol-formaldehyde resins having the benzyl ether linkages and an infra-red spectrum exhibiting large adsorption at wave numbers of 1230 cm.sup.-1, 1060 cm.sup.-1 and 1010 cm.sup.-1, causing a decrease of at least 35% in the ratio of absorbance at 1010 cm.sup.-1, measured from a base line drawn between wave numbers of 1030 cm.sup.-1 and 950 cm.sup.-1 to that at 1230 cm.sup.-1, measured from a base line drawn between wave numbers of 1130 cm.sup.-1 and 1310 cm.sup.-1, while leaving substantially unaltered the absorbance at wave numbers of 1230 cm.sup.-1 and 1060 cm.sup.-1. These novel resins are capable of many applications and are normally tack-free, although the tack may be controlled by the addition of an organic solvent, such as phenol, thereto. In a second embodiment, the resins are formed at a mole ratio of formaldehyde to phenol of above 1.7:1 in an aqueous reaction medium. The resins form acid-catalyzed, room-temperature stable and mobile resins which may be applied as a one component curable system onto substrates for the formation of molded articles, such as rice husk boards.
REFERENCES:
patent: 3485797 (1969-12-01), Robins
patent: 3501552 (1970-03-01), Robins
patent: 3535185 (1970-10-01), Tveten
Chandramouli Pitchaiya
Vasishth Ramesh C.
Cor Tech Research Limited
Woodberry Edward M.
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