Coating processes – Direct application of electrical – magnetic – wave – or... – Ion plating or implantation
Reexamination Certificate
2007-03-13
2007-03-13
McDonald, Rodney G. (Department: 1753)
Coating processes
Direct application of electrical, magnetic, wave, or...
Ion plating or implantation
C414S253000, C414S288000, C414S342000, C414S345000, C414S373000, C427S530000, C427S531000
Reexamination Certificate
active
10337642
ABSTRACT:
An exemplary method for using a mobile plating system is provided that includes locating the mobile plating system at a desired location for plating, positioning an external vacuum pump from an interior position of a mobile storage volume of the mobile plasma plating system to an exterior position, and coupling the external vacuum pump to a vacuum chamber within the mobile storage volume of the mobile plasma plating system using a flexible piping segment, rigid coupling with a dampening effect, or other arrangement operable to reduce and/or eliminate the mechanical vibrations within the vacuum chamber due to the operation of the external vacuum pump.
REFERENCES:
patent: 2241228 (1941-05-01), Weinhart
patent: 3329601 (1967-07-01), Mattox
patent: 3719052 (1973-03-01), White
patent: 3756847 (1973-09-01), Leibowitz et al.
patent: 3857682 (1974-12-01), White
patent: 3961103 (1976-06-01), Aisenberg
patent: 4016389 (1977-04-01), White
patent: 4039416 (1977-08-01), White
patent: 4054426 (1977-10-01), White
patent: 4062319 (1977-12-01), Roth et al.
patent: 4082636 (1978-04-01), Takagi
patent: 4126521 (1978-11-01), Coffin
patent: 4137370 (1979-01-01), Fujishiro et al.
patent: 4213844 (1980-07-01), Morimoto et al.
patent: RE30401 (1980-09-01), White
patent: 4282597 (1981-08-01), Yenawine et al.
patent: 4293171 (1981-10-01), Kakumoto et al.
patent: 4310614 (1982-01-01), Connell et al.
patent: 4342631 (1982-08-01), White et al.
patent: 4352370 (1982-10-01), Childress
patent: 4407712 (1983-10-01), Henshaw et al.
patent: 4420386 (1983-12-01), White
patent: 4461689 (1984-07-01), Diepers
patent: 4468309 (1984-08-01), White
patent: 4480010 (1984-10-01), Sasanuma et al.
patent: 4530885 (1985-07-01), Restall
patent: 4540596 (1985-09-01), Nimmagadda
patent: 4603057 (1986-07-01), Ueno et al.
patent: 4667620 (1987-05-01), White
patent: 4673586 (1987-06-01), White
patent: 4725345 (1988-02-01), Sakamoto et al.
patent: 4826365 (1989-05-01), White
patent: 4852516 (1989-08-01), Rubin et al.
patent: 4863581 (1989-09-01), Inokuti et al.
patent: 4885069 (1989-12-01), Coad
patent: 4938859 (1990-07-01), Ide et al.
patent: 4956858 (1990-09-01), Upadhya
patent: 4990233 (1991-02-01), Hahn
patent: 5061512 (1991-10-01), Upadhya
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5078847 (1992-01-01), Grosman et al.
patent: 5085499 (1992-02-01), Griffin et al.
patent: 5116784 (1992-05-01), Ushikawa
patent: 5208079 (1993-05-01), Fukushima et al.
patent: 5225057 (1993-07-01), LeFebvre et al.
patent: 5227203 (1993-07-01), Kibe et al.
patent: 5252365 (1993-10-01), White
patent: 5380420 (1995-01-01), Tsuji
patent: 5403419 (1995-04-01), Yoshikawa et al.
patent: 5409762 (1995-04-01), Ozaki et al.
patent: 5514260 (1996-05-01), Seo
patent: 5556519 (1996-09-01), Teer
patent: 5595814 (1997-01-01), Yamagata et al.
patent: 5611655 (1997-03-01), Fukasawa et al.
patent: 5730847 (1998-03-01), Hanaguri et al.
patent: 5744811 (1998-04-01), Schonberg et al.
patent: 5798496 (1998-08-01), Eckhoff et al.
patent: 5863842 (1999-01-01), Ohmi
patent: 5889587 (1999-03-01), D'Silva et al.
patent: 5961798 (1999-10-01), Robinson et al.
patent: 6090157 (2000-07-01), Traut et al.
patent: 6117280 (2000-09-01), Yaginuma et al.
patent: 6153270 (2000-11-01), Russmann et al.
patent: 6156392 (2000-12-01), Duffy et al.
patent: 6503379 (2003-01-01), Kidd et al.
patent: 6521104 (2003-02-01), Kidd et al.
patent: 2003/0159926 (2003-08-01), Kidd et al.
patent: 2118 082 (1972-10-01), None
patent: 44 18 161 (1995-11-01), None
patent: 0 374 060 (1990-06-01), None
patent: 0 492 511 (1992-07-01), None
patent: 0 653 252 (1999-05-01), None
patent: WO 01/90436 (2001-11-01), None
patent: WO 01/90437 (2001-11-01), None
U.S. Appl. No. 10/955,899 entitledPlatform Assembly and Method, filed Sep. 30, 2004; Inventors: Jerry D. Kidd et al. (copy enclosed).
U.S. Appl. No. 09/472,775, filed Oct. 26, 1999 entitledSystem and Method for Plasma Plating, by Applicants: Jerry D. Kidd, Craig D. Harrington, Daniel N. Hopkins.
U.S. Appl. No. 10/103,725, filed Mar. 22, 2002 entitledSystem and Method for Preventing Breaker Failure, by Applicants: Jerry D. Kidd, Craig D. Harrington, Daniel N. Hopkins.
U.S. Appl. No. 09/576,640, filed May 22, 2002 entitledMobile Plating System and Method, by Applicants: Jerry D. Kidd, Craig D. Harrington, Daniel N. Hopkins.
U.S. Appl. No. 09/578,166, filed May 22, 2002 entitledConfigurable Vacuum System and Method, by Applicants: Jerry D. Kidd, Craig D. Harrington, Daniel N. Hopkins.
U.S. Appl. No. not assigned, filed Jan. 6, 2003 entitledMobile Planting System and Method, by Applicants: Jerry D. Kidd, Craig D. Harrington, Daniel N. Hopkins.
Bunshah, R.F.Handbook of Deposition Technologies for Films and Coatings, 1994, Second Edition, Noyes Publication, Westwood, New Jersey U.S.A. (PLEASE NOTE: This reference was donated to Group Art Unit 1762 and is available through Examiner Marianne Padgett, who can be reached at 703.308.2336).
Bunshah, R. F., Microstructure and Properties, article fromHandbook of Deposition Technologies for Films and Coatings, 1994, 7 pgs., Second Edition, Noyes Publications, Westwood, New Jersey U.S.A.
Bartlett, Edwin S. et al., Oxidation Protective Coatings for Superalloys and Refractory Metals, article fromMetals Handbook. Ninth Edition, vol. 5 Surface Cleaning, Finishing, and Coating, 1982, 57 pgs., American Society for Metals, Metals Park, Ohio.
Harper, James M.E. et al.., Modification of Thin Film Properites by Ion Bombardment During Deposition, Chapter 4 fromIon Bombardment Modification of Surfaces, 1984, 4 pgs., Elsevier Science Publishers B.V., Amsterdam, The Netherlands.
Hopkins, Daniel N. et al.,Magion: Reduce Galling, Control Friction, Save Money, 1997, 10 pgs., TU Electric, Glen Rose, Texas.
Hopkins, Daniel N. et al.,Use of Engineered Surfaces to Reduce Galling, Control Friction, and Save Money, 1998, 11 pgs., TU Electric, Glen Rose, Texas.
Hopkins, Daniel N. et al.,Magion: Engineered Surfaces to Control Galling and Reduce Maintenance Costs, 1998, 5 pgs., TU Electric, Glen Rose, Texas.
Hopkins, Daniel N. et al.,Reduce Maintenance Costs by Using Engineered Surfaces to Control Friction and Galling, 1999, Reprinted from WEAR, 14 pgs., TU Electric, Glen Rose, Texas.
Kazan, Joe, et al., Maglon, article fromEnergy Digest, 1997, 4 pgs., Westinghouse Electric Company, Pittsburgh, Pennsylvania.
Metal Seals, article fromNuclear News, 1997, 2 pgs., American Nuclear Society, LaGrange Park, Illinois.
Kidd, Jerry,Maglon: The Metallurgical Anti-Sieze Lubricant, 1998, 13 pgs., TU Electric, Glen Rose, Texas.
Black, Bill R. et al.,Engineered Surfaces Reduce Maintenance Costs, 1998, 6 pgs., TU Electric, Glen Rose, Texas.
Black, Bill R. et al.,Vacuum Coating Mitigates Galling, controls Friction, 1999, 3 pgs., Power Magazine.
Pamphlet,Maglon, Mitigate Galling, Control Friction, Reduce Cost with. . ., 1998, 3 pgs., Westinghouse Electric Company, Madlaon, Pennsylvania.
Dulaney, R.R. et al.,Maglon Recommendations(Technical), 1999, 2 pgs., Westinghouse Electric Company.
Instructions for Low-Voltage Power Circuit Breakers Types DS and DSL, 1979, 94 pgs., Westinghouse Electric Company, East Pittsburgh, Pennsylvania.
Aronson, A. J. et al.,Preparation of Titanium Nitride by a Pulsed D.C. Magnetron Reactive Deposition Technique Using the Moving Mode of Deposition, 1980, 6 pgs., Materials Research Corporation, Orangeburg, New York.
Mattox, D. M.,Fundamentals of Ion Plating, 1973, 6 pgs., Sandia Laboratories, Albuquerque, New Mexico.
Geis, Charles G. et al.,Maintenance Program Manual MPM-DS Breaker For Westinghouse Type DS Circuit Breakers and Associated Switchgear, 1993, 150 pgs., Westinghouse Electric Company, Pittsburgh, Pennsylvania.
Harrington Craig D.
Hopkins Daniel N.
Kidd Jerry D.
Basic Resources Inc.
Hunton & Williams LLP
McDonald Rodney G.
LandOfFree
Mobile plating system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mobile plating system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mobile plating system and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3757796