Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2005-02-22
2005-02-22
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298230, C204S298250, C204S298270, C204S298280, C204S298350, C118S719000, C118S7230VE, C118S7230EB, C118S7230ER, C118S729000, C118S730000, C414S253000, C414S208000, C414S342000, C414S345000, C414S373000, C414S390000, C414S391000, C414S399000, C414S591000, C414S592000, C414S217000, C414S221000, C414S227000, C414S233000, C414S234000, C414S241000
Reexamination Certificate
active
06858119
ABSTRACT:
An exemplary mobile plating system is provided for performing a plating process using virtually any known or available deposition technology for coating or plating as substrate. The mobile plating system may include a vacuum chamber positioned in a mobile storage volume, an external vacuum pump, and a control circuitry to control the operation of some or all of the operations of the external vacuum pump. The external vacuum pump is positioned in the mobile storage volume when the mobile plating system is in transit, and is positioned external to the mobile storage volume when the mobile plating system is stationary and in operation. The external vacuum pump may be mounted on a skid, and, in operation, the external vacuum pump couples with the vacuum chamber to assist with producing a desired pressure in the vacuum chamber. The external vacuum pump couples with the vacuum chamber using a flexible piping segment and/or dampening arrangement to reduce and/or eliminate any mechanical vibrations within the vacuum chamber and within the mobile storage volume due to the operation of the external vacuum pump.
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Harrington Craig D.
Hopkins Daniel N.
Kidd Jerry D.
Basic Resources Inc.
Hunton & Williams LLP
McDonald Rodney G.
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