Semiconductor device manufacturing: process – Direct application of electrical current
Patent
1998-07-21
2000-10-24
Niebling, John F.
Semiconductor device manufacturing: process
Direct application of electrical current
438468, 438787, 324765, H01L 21326
Patent
active
061366692
ABSTRACT:
A semi conductor manufacturing process including uniform negative polarity wafer charging to remove or immobilize alkali ions such that the device becomes immune to their presence. The wafer is charged with a corona discharge at a 1MV/cm-2MV/cm bias field and low temperature (200.degree. C.-300.degree. C.) heating to bring mobile ions to the wafer's surface. Surface mobile ions are removed with a deionized (DI) water rinse or a standard sequential wafer wet cleaning step, immobilized with a normal gate (polysilicon) or metal contact formation step or both, thereby effectively removing mobile ions from the semiconductor structure.
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Flitsch Frederick Albert
Fung Min-Su
International Business Machines - Corporation
Lattin Christopher
Niebling John F.
Sabo William D.
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