Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate
2006-12-26
2006-12-26
Scheiner, Laurie (Department: 1648)
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
C428S385000
Reexamination Certificate
active
07153589
ABSTRACT:
A Mo—W material for the formation of wirings is discloses which, as viewed integrally, comprises 20 to 95% of tungsten and the balance of molybdenum and inevitable impurities by atomic percentage. The Mo—W material for wirings is a product obtained by compounding and integrating a Mo material and a W material as by the powder metallurgy technique or the smelting technique or a product obtained by arranging these materials in amounts calculated to account for the percentage composition mentioned above. The Mo—W material containing W in a proportion in the range of from 20 to 95% manifests low resistance and, at the same time, excels in workability and tolerance for etchants. The wiring thin film which is formed of the Mo—W alloy of this percentage composition is used as address wirings and others for liquid crystal display devices. The Mo—W target for the formation of wirings is composed of 20 to 95% of tungsten and the balance of molybdenum and inevitable impurities by atomic percentage and allows the Mo—W wiring thin film to be produced with high repeatability.
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Fukasawa Yoshiharu
Ikeda Mitsushi
Kohsaka Yasuo
Maki Toshihiro
Sato Michio
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Scheiner Laurie
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