Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1991-11-07
1993-05-25
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257724, 257701, H01L 2302, H01L 2348
Patent
active
052144984
ABSTRACT:
A package for electronic components, especially MMIC components, is disclosed. The package is constructed from layers of ceramic cofired to form an annular piece. Metal pieces are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines to electronic components within the package and low loss RF feedthroughs into the package.
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Bilski Stacey M.
Lehman George R.
Miller Steven W.
Clark William R.
LaRoche Eugene R.
Nguyen Viet Q.
Raytheon Company
Sharkansky Richard M.
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