Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Patent
1999-01-26
2000-09-26
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
257532, 257700, 257703, 257778, H01L 2334
Patent
active
061246360
ABSTRACT:
Disclosed herein is an MMIC package which comprises a base substrate, a composite capacitor substrate made of a ceramics plate mounted on the base substrate, an MMIC bare chip which functions as a high frequency semiconductor element and face-down bonded on the composite capacitor substrate, and an electroconductive covering which covers, together with the base substrate, the MMIC bare chip. In order to suppress the deterioration of the electrical characteristics of the above MMIC, the above components are so arranged that the interconnection length between the components is made to be minimum.
REFERENCES:
patent: 5045820 (1991-09-01), Leicht et al.
patent: 5521406 (1996-05-01), Tserng
Chaudhuri Olik
NEC Corporation
Wille Douglas A.
LandOfFree
MMIC package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with MMIC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MMIC package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2102550