MMIC die attach design for manufacturability

Details MMIC die attach design for manufacturability MMIC die attach design for manufacturability

1990-01-10

1992-04-14

Jackson, Jr., Jerome

Fishing, trapping, and vermin destroying

357 40, 437184, 437209, 437924, H01L 2944, H01L 2702

Patent

active

051052555

ABSTRACT:
An improved semiconductor device for use in microwave integrated circuits is disclosed. In particular, an improved monolithic integrated circuit (10) comprised of a semi-insulating substrate (12) and having an integrated circuit on a top surface (14) thereof. MMIC (10) is provided with free area (38) of a predetermined width extending along the entire periphery or at least two opposing sides and which is void of active circuitry. Free area (38) permits intimate mating contact with a die collet tool (58). Die collet tool (58) has a surface configured to matingly engage free areas (38) while avoiding contact with the active circuitry so as to avoid damage thereto. MMIC (10) permits application of high volume, automated manufacturing processes which previously could not be utilized.

REFERENCES:
patent: 3568307 (1971-03-01), Zanger et al.
patent: 3955163 (1976-05-01), Novak
patent: 4656055 (1987-04-01), Dwyer
patent: 4832761 (1989-05-01), Geissberger et al.
patent: 4970578 (1990-11-01), Tong et al.

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