MLC conductor pattern off-set design to eliminate line to via cr

Details MLC conductor pattern off-set design to eliminate line to via cr MLC conductor pattern off-set design to eliminate line to via cr

1994-01-24

1995-08-29

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 524, H05K 0100

Patent

active

054462460

ABSTRACT:
A semiconductor ceramic packaging substrate has the usual vias of sintered electrically conductive metal extending through the substrate. There are the usual metal conductor lines comprising conductive elements on the surface of the substrate. Each via is connected to the conductive elements in a predetermined pattern through a conductive via cap on the surface of the ceramic package. The caps join each conductive element and each via. The cap has a width substantially larger than the diameter of the via at the point of contact of the via and the conductive element in contact with it. The caps are also substantially thicker and wider than the conductive elements.

REFERENCES:
patent: 3335489 (1967-08-01), Grant
patent: 3571923 (1971-03-01), Shaheen et al.
patent: 3859711 (1975-01-01), McKiddy
patent: 4340436 (1982-07-01), Dubetsky et al.
patent: 4808434 (1989-02-01), Bennett et al.
patent: 5023699 (1991-06-01), Hara et al.
patent: 5081067 (1992-01-01), Shimizu et al.

Affiliated with

Also associated with

Rating

MLC conductor pattern off-set design to eliminate line to via cr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MLC conductor pattern off-set design to eliminate line to via cr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MLC conductor pattern off-set design to eliminate line to via cr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1820954