Data processing: measuring – calibrating – or testing – Testing system – Of circuit
Reexamination Certificate
1998-07-10
2003-09-23
Hoff, Marc S. (Department: 2857)
Data processing: measuring, calibrating, or testing
Testing system
Of circuit
C324S755090, C714S724000
Reexamination Certificate
active
06625557
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATIONS
Not Applicable
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH
Not Applicable
REFERENCE TO MICROFICHE APPENDIX
Not Applicable
BACKGROUND OF THE INVENTION
This invention relates to high performance mixed signal integrated circuit (IC) testing systems and, more particularly, to a mixed signal device under test (DUT) board interface adapted to provide high functionality by providing high quality and high density analog and digital testing and signal connections to the IC device being tested.
IC testing systems typically test ICs either before a die bearing the circuit is detached from a wafer or after the IC is packaged on a chip carrier. Depending upon the functionality of the IC, the IC testing system may require both analog and digital signal testing circuitry as well as different types of analog or digital circuitry. As used herein, mixed signal testing is intended to include not only hybrid analog and digital signal testing, but also combinations of different types of analog or digital signal testing, for example general purpose analog and high speed analog, audio and video, or digital and high speed digital signals). For example, digital audio and video ICs used in Compact Disc and video disc players process digital signals as well as generate analog signals used to produce the analog sounds or video images. As these components increase in functionality and become more complex, the IC testing systems required to test these components must increase, not just in signal testing density (i.e. the number of digital or analog circuits that can be tested) but also in the mix or diversity of signal types (i.e. digital signals, audio signals, video signals, radio frequency signals, power signals, power control signals, etc.) that can be tested.
In order to test an IC on a wafer, typically, the test electronics which include individual circuit testing modules, are mounted in a test head at one end of an articulated arm. The test head can accommodate a plurality of different types of circuit testing modules, including for example, digital circuit testing modules (also referred to as Digital Pin Electronics Cards) and analog circuit testing modules which can include audio, video and/or RF circuit testing instrumentation. Mounted on one surface of the test head is the device under test board or DUT board. The DUT board includes a printed circuit board or similar electronic interconnect board that receives signals from a DUT board interface and connects them to the appropriate points of the device under test (e.g. the IC) on the wafer. The DUT board is sized to fit into an opening in the wafer handler, generally less than 12 inches in diameter. Once the DUT board is positioned in the opening, the wafer handler moves the wafer in position to allow probe pins on the DUT board to contact the appropriate points of the IC on the wafer in order to allow testing of various circuit elements of the IC.
In order to test a packaged IC, a different type of DUT board is used. This type of DUT board includes a socket that is adapted to receive the packaged IC and make electrical contact with the leads of the package in order to connect the circuit testing modules to the IC. In this embodiment, a part handling device, such as a pick and place robotic manipulator, is used to pick up the packaged IC and position it in the socket to be tested. The test head and the DUT board remain stationary during this process.
In typical analog circuit testing applications, it is often necessary to provide signal conditioning circuitry between the digital or analog circuit testing modules and the IC. This signal conditioning circuitry is typically provided on a load board which is inserted in the signal path between the circuit testing module and the DUT board. One of the disadvantages of using a load board in mixed signal applications is that the length of the signal path between the circuit testing modules and the IC is increased and consequently, the digital signal testing performance is decreased. In addition, the space available for signal conditioning circuitry on the load board becomes limited as the analog and digital testing channel density increases.
Accordingly, it is an object of this invention to provide an improved mixed signal integrated circuit testing system.
It is another object of this invention to provide an improved mixed signal integrated circuit testing system adapted to provide high performance digital signal testing.
It is a further object of this invention to provide an improved mixed signal integrated circuit testing system adapted to provide high density analog and digital signal testing instrumentation.
It is a still further object of this invention to provide an improved mixed signal integrated circuit testing system adapted to provide high density analog and digital signal testing instrumentation and increased load board signal conditioning capacity.
It is a still further object of this invention to provide an improved mixed signal integrated circuit testing system adapted to provide high density mixed signal testing instrumentation which can provide substantially the short signal delays need to test one type of circuitry as well as provide a replaceable or reconfigurable system configuration module for providing different types of signal conditioning circuitry.
SUMMARY OF THE INVENTION
The present invention is directed to mixed signal circuit testing systems adapted for testing highly integrated circuits (ICs) which can include various types of high performance digital and analog circuitry. The analog circuit types can include, for example, audio, video, power, power control, and radio frequency. In accordance with the invention, the mixed signal circuit testing system is adapted to provide high signal testing channel density as well as high performance digital signal test functions and diverse analog signal testing functionality. The system is also adapted to conform to conventional physical size requirements for testing ICs on a wafer and thus can serve to replace prior art integrated circuit testing systems.
The testing function of a system in accordance with the invention is accomplished by removably connecting (such as by means of a socket or pin probes) at least a portion of the IC to an analog and/or digital test module. The test modules can include the signal generating and signal measuring instrumentation necessary to perform a broad range of analog or digital test functions
A mixed signal IC testing system in accordance with the present invention includes a system controller adapted for controlling a first type of circuit testing module and a second type of circuit testing module. The circuit testing modules are mounted in a test head and operatively coupled to the system controller. A DUT board provides a means for connecting the mixed signal IC testing system to the IC being tested. The DUT board is mounted to a DUT board interface adapter which defines the DUT board interface. The first type of circuit testing module is operatively connected to a first portion of a DUT board interface adaptor via a first interconnect coupling. The second type of circuit test module is operatively coupled to a second portion of the DUT board interface adapter via a system configuration module. The system configuration module is connected to the second portion of the DUT board interface adapter via a second interconnecting coupling and to the second type of circuit testing module via a third interconnect coupling. The system configuration module can be removable in order to provide the flexibility to test a wide range of circuit types as well as a varying mix of circuit types and configuration.
The DUT board interface adapter can include a first interface adapter element nested with a second interface adapter element. The first interface adapter element can be connected to the first type of circuit testing module and the second interface adapter element can be connected to the second type of circuit testing module. In one embodiment, the first interfac
Creek William R.
Curry David W.
Perkins Philip E.
Charioui Mohamed
Hoff Marc S.
LTX Corporation
McDermott & Will & Emery
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