Mixed-scale electronic interface

Details Mixed-scale electronic interface Mixed-scale electronic interface

2009-12-03

2010-11-16

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

With electrical circuit layout

C438S280000

Reexamination Certificate

active

07833842

ABSTRACT:
Embodiments of the present invention are directed to mixed-scale electronic interfaces, included in integrated circuits and other electronic devices, that provide for dense electrical interconnection between microscale features of a predominantly microscale or submicroscale layer and nanoscale features of a predominantly nanoscale layer. A method is provided for fabricating a nanoscale/microscale interface having a microscale layer and a predominantly nanoscale layer.

REFERENCES:
patent: 4486705 (1984-12-01), Stopper
patent: 7094674 (2006-08-01), Graf et al.
patent: 7256435 (2007-08-01), Kornilovich
patent: 7307271 (2007-12-01), Islam
patent: 7327037 (2008-02-01), Basavanhally et al.
patent: 7423285 (2008-09-01), Ohki
patent: 2004/0113138 (2004-06-01), DeHon
patent: 2005/0055387 (2005-03-01), Kuekes
patent: 1484644 (2004-12-01), None
patent: 03063208 (2003-07-01), None
Ziegler M M et al-“CMOS/Nano Co-Design for Crossbar-Based Molecular Electronics System”-IEEE Transactions on Nanotechnology-IIol2 No. 4 12J0412003-pp. 217-230.
Houel A et a, . . . Direct patterning of nanostructures by field-induced deposition from a sacanning tunneling microscope tip—Joum of Vacuum Science & Technology-vol. 20n06 11102.

Affiliated with

Also associated with

Rating

Mixed-scale electronic interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mixed-scale electronic interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mixed-scale electronic interface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4246033