Mixed LVR and HVR reticle set design for the processing of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S622000, C438S197000

Reexamination Certificate

active

06900075

ABSTRACT:
An embodiment of the present invention provides a novel method which makes LVR to HVR registration possible by wrapping the X and Y scribes around each instance of each layer on both the LVR and HVR reticles; standard HVR reticles and LVR reticles will not align to one another due to registration and electrical test structures in the scribe being in different locations. Another embodiment of the present invention addresses the loss of die per wafer due to increased sribe area when using LVR and HVR reticles in the same set.

REFERENCES:
patent: 6232051 (2001-05-01), Suzuki

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