Mixed LVR and HVR reticle set design for the processing of...

Details Mixed LVR and HVR reticle set design for the processing of... Mixed LVR and HVR reticle set design for the processing of...

2005-05-31

2005-05-31

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S622000, C438S197000

Reexamination Certificate

active

06900075

ABSTRACT:
An embodiment of the present invention provides a novel method which makes LVR to HVR registration possible by wrapping the X and Y scribes around each instance of each layer on both the LVR and HVR reticles; standard HVR reticles and LVR reticles will not align to one another due to registration and electrical test structures in the scribe being in different locations. Another embodiment of the present invention addresses the loss of die per wafer due to increased sribe area when using LVR and HVR reticles in the same set.

REFERENCES:
patent: 6232051 (2001-05-01), Suzuki

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