Miter saw

Cutting – Rotatable disc tool pair or tool and carrier – With means to support work relative to tool

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C083S471300, C083S485000, C083S490000

Reexamination Certificate

active

07997177

ABSTRACT:
A miter saw for cutting a workpiece is disclosed. The miter saw has a base section, a holder section, a saw blade section, a saw blade support section, and a guide bar. The base section has an upper surface for supporting a workpiece to be cut. The holder section stands from the base portion. The saw blade section has a circular saw blade for cutting the workpiece. The saw blade support section pivotably supports the saw blade section. The guide bar slidably supports the saw blade support section. The guide bar is slidably supported by the holder section. The guide bar extends substantially parallel to the upper surface of the base section. The saw blade support portion is slidable along the guide bar.

REFERENCES:
patent: 1852387 (1932-04-01), Wieden
patent: 3302669 (1967-02-01), Edler
patent: 4036093 (1977-07-01), Thorsell
patent: 5060548 (1991-10-01), Sato et al.
patent: 5129738 (1992-07-01), Nakagawa
patent: 5241888 (1993-09-01), Chen
patent: 5907987 (1999-06-01), Stumpf et al.
patent: 2002/0144582 (2002-10-01), He
patent: 2005/0066788 (2005-03-01), Chang
patent: 2005/0098010 (2005-05-01), Hu
patent: 2 372 451 (2003-08-01), None
patent: 20 2004 004 929 (2004-06-01), None
patent: 1 510 307 (2005-03-01), None
patent: S47-025751 (1972-08-01), None
patent: 62-11526 (1987-01-01), None
patent: S62-041503 (1987-03-01), None
patent: 62-200401 (1987-12-01), None
patent: H07-047502 (1995-02-01), None
patent: H09-164504 (1997-06-01), None
patent: H11-198101 (1999-07-01), None
patent: 2003-245901 (2003-09-01), None
Japanese Office Action dated Mar. 2, 2010 for Application No. 2004-255599.
Decision of Rejection dated Oct. 26, 2010 for Application No. 2004-255599.
Japanese Office Action dated Apr. 12, 2011 for Japanese Patent Application No. 2004-255599.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Miter saw does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Miter saw, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Miter saw will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2640074

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.