Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Patent
1995-12-18
1997-09-02
Mullins, James B.
Amplifiers
With semiconductor amplifying device
Including distributed parameter-type coupling
330 65, H03F 368
Patent
active
056636830
ABSTRACT:
A mist cooled distributed amplifier utilizing a connectorless module. The amplifier comprises modules that are connected to waveguides in a honeycomb. The RF signals are distributed to and combined from the modules using a distributed waveguide manifold. Cooling is accomplished by forming channels between the modules through which mist is transmitted and collected and condensed at the output end.
REFERENCES:
patent: 4283685 (1981-08-01), MacMaster et al.
patent: 4939527 (1990-07-01), Lamberty et al.
patent: 5099254 (1992-03-01), Tsukii
patent: 5140335 (1992-08-01), Staehlin et al.
patent: 5214394 (1993-05-01), Wong
patent: 5276455 (1994-01-01), Fitzsimmons et al.
patent: 5327152 (1994-07-01), Kruger et al.
George W. Fitzsimmons et al. "A Connectorless Module for an EHF Phased-Array Antenna", Jan. 1994, pp. 114-126, Microwave Journal.
Gardner Conrad O.
Mullins James B.
The Boeing Company
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