Mirror including dielectric portions and a method of...

Details Mirror including dielectric portions and a method of... Mirror including dielectric portions and a method of...

2008-07-29

2008-07-29

Vinh, Lan (Department: 1792)

Etching a substrate: processes

Forming or treating an ornamented article

Treating glass

C216S026000, C359S214100, C359S223100

Reexamination Certificate

active

07404909

ABSTRACT:
The invention provides a method for manufacturing a microelectronic device and a microelectronic device. The method for manufacturing the microelectronic device, without limitation, may include forming a first mirror layer over and within one or more openings in a sacrificial spacer layer, and forming a dielectric layer over an upper surface of the first mirror layer and within the one or more openings. The method may further include subjecting the dielectric layer to an etch, the etch removing the dielectric layer from the upper surface and leaving dielectric portions along sidewalls of the one or more openings, and forming a second mirror layer over the first mirror layer and within the one or more openings, the dielectric portions separating the first mirror layer and the second mirror layer along the sidewalls.

REFERENCES:
patent: 5212582 (1993-05-01), Nelson
patent: 5278012 (1994-01-01), Yamanaka et al.
patent: 6760145 (2004-07-01), Taylor et al.
patent: 2005/0218476 (2005-10-01), Lee et al.

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