Mirror image electrical packages and system for using same

Details Mirror image electrical packages and system for using same Mirror image electrical packages and system for using same

2007-10-30

2007-10-30

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S777000

Reexamination Certificate

active

10869533

ABSTRACT:
A mirror image package is disclosed along with several embodiments for using such package in connection with a normal package. Embodiments include side-by-side and top-over-bottom mounting arrangements. Embodiments also include color or graphic coding so that normal and mirror image chips may be easily distinguished.

REFERENCES:
patent: 4651416 (1987-03-01), DePaul
patent: 4994896 (1991-02-01), Uemura et al.
patent: 5012389 (1991-04-01), Perry
patent: 5309020 (1994-05-01), Murasawa et al.
patent: 5383148 (1995-01-01), Testa et al.
patent: 5502621 (1996-03-01), Schumacher et al.
patent: 5585667 (1996-12-01), Asanasavest
patent: 5644102 (1997-07-01), Rostoker
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6192431 (2001-02-01), Dabral et al.
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6442056 (2002-08-01), Nuxoll et al.
patent: 6894379 (2005-05-01), Feurle
patent: 6948137 (2005-09-01), Kikuchi
patent: 6979910 (2005-12-01), Shirasaka
patent: 01076748 (1989-03-01), None
patent: 06140566 (1994-05-01), None
Google Search Results on “Reversed Pinout TSOP,” generated Apr. 9, 2007, 71 pages.
AMD IC Package Codes, “Part Number System for Reversed Pinout SOIC,” Packages and Packing Publication Revision A, Mar. 1, 2003.
AMD, “Part Number System for Reversed Pinout SOP,” undated.
B. Qureshi, et al., “AP-607 Application Note: Multi-Site Layout Planning with Intel's FlashFile(TM) Components, Including ROM Compatibility,” Dec. 1995.
AMD Publication #21445, Rev: B, Amendment +2, “AM29F040B 4 Megabit (512 K×8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory,” Apr. 1998.
AMD Publication #21504, Rev: E, Amendment/+1, “AM29F800B 8 Megabit (1 M×8-Bit/512 K×16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory,” Aug. 4, 2000.
Hyundai Semiconductor; Hyundai Product Description Rev: 03, “HY29F400T/B Series: 4 Megabit 5.0 volt-only Sector Erase Flash Memory,” Aug. 97.
Intel(r) Small Outline Package Guide, “SOP Layout Features and Applications,” 1999.
NEC Electronics Corporation, “Product Data Sheet: MOS Integrated Circuit uPD43256B—256K-Bit CMOS Static RAM 32K-Word By 8-Bit,” Document No. M10770EJEV0DS00 (14th edition), Jun. 2006.
Fujitsu Semiconductor Data Sheet, “Flash Memory: CMOS 2 M (256 K×8) Bit MBM26LV002T-12-x/MBM29LV002B-12-x,” undated.
Mitsubishi Electric; “Mar. 25, 1997 Mitusubishi LSIs M5M51008BP, FP, VP, RV, KV, KR -55L, -70L, -10L, -55LL, -70LL, -10LL: 1048576-BIT (131072-Word By 8-Bit) CMOS Static RAM,” 1997.
Cypress Semiconductor Corporation, “CY62256: 32K×8 Static RAM,” Feb. 18, 2002.
STMicroelectronics, “M29F040: 4 Mbit (512Kb×8, Uniform Block) Single Supply Flash Memory,” Nov. 1999.
RF Micro Devices; “W-LAN/Bluetooth: Internix Newsletter No. 90,” undated.
Pro Systems, “Mirrored Pinout to simplify circuit board layout,” undated.
Micron Semiconductor Products, Inc., “Rambus(r) DRAM: 128Mb/144: 8 MEG×16/18 RDRAM,” copyright 2000.
Cypress Semiconductor Corporation; “QDR SRAM: Assembly Considerations;” Jun. 2001.
Effy Deal Global Co., Ltd, “QDR SRAM: Assembly,” copyright 2006.
Google Search Results on “Mirrored Pinout,” generated on Apr. 10, 2007.

Affiliated with

Also associated with

Rating

Mirror image electrical packages and system for using same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mirror image electrical packages and system for using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mirror image electrical packages and system for using same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3874079