Minimum contact area wafer clamping with gas flow for rapid...

Material or article handling – Apparatus for moving material between zones having different...

Reexamination Certificate

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C414S805000, C414S935000

Reexamination Certificate

active

08033771

ABSTRACT:
Apparatuses and methods for cooling and transferring wafers from low pressure environment to high pressure environment are provided. An apparatus may include a cooling pedestal and a set of supports for holding the wafer above the cooling pedestal. The average gap between the wafer and the cooling pedestal may be no greater than about 0.010 inches. Venting gases may be used to increase the pressure inside the apparatus during the transfer. In certain embodiment, venting gases comprise nitrogen.

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