Minimization of cooling air preheat for maximum packaging...

Details Minimization of cooling air preheat for maximum packaging... Minimization of cooling air preheat for maximum packaging...

2007-06-26

2007-06-26

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S721000, C174S016100, C165S080200, C165S122000

Reexamination Certificate

active

10992451

ABSTRACT:
An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet, each of which includes a heat-generating component. The electronic assemblies are positioned so that a portion of the stream of air is heated by a first one of the heat-generating components and, thereafter, that portion of the stream of air moves toward a second one of the heat-generating components. An airflow diverter is positioned between the electronic assemblies to deflect that portion of the stream of air heated by the first heat-generating component to prevent it from reaching the second heat-generating component.

REFERENCES:
patent: 4612979 (1986-09-01), Heitzig
patent: 4797783 (1989-01-01), Kohmoto et al.
patent: 5361188 (1994-11-01), Kondou et al.
patent: 5528454 (1996-06-01), Niklos
patent: 5544012 (1996-08-01), Koike
patent: 5721670 (1998-02-01), Cochrane et al.
patent: 5995368 (1999-11-01), Lee et al.
patent: 6283850 (2001-09-01), Toshimitsu et al.
patent: 6400567 (2002-06-01), McKeen et al.
patent: 6421238 (2002-07-01), Negishi
patent: 6459579 (2002-10-01), Farmer et al.
patent: 6678156 (2004-01-01), Moizer
patent: 6717807 (2004-04-01), Hikawa
patent: 6876549 (2005-04-01), Beitelmal et al.
patent: 6912129 (2005-06-01), Baker et al.
patent: 2005/0264995 (2005-12-01), Hanson
patent: 56147458 (1981-11-01), None
patent: 01089599 (1989-04-01), None
patent: 04027197 (1992-01-01), None
patent: 05327253 (1993-12-01), None

Affiliated with

Also associated with

Rating

Minimization of cooling air preheat for maximum packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Minimization of cooling air preheat for maximum packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Minimization of cooling air preheat for maximum packaging... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3845164