Minimal thermal expansion, high thermal conductivity metal-ceram

Details Minimal thermal expansion, high thermal conductivity metal-ceram Minimal thermal expansion, high thermal conductivity metal-ceram

1997-06-30

2000-10-17

Jenkins, Daniel J.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Metal and nonmetal in final product

419 35, 419 49, B22F 102

Patent

active

061326763

ABSTRACT:
The invention provides techniques for forming composites including XW.sub.2 O.sub.8, where X=Zr, Hf, or a combination, dispersed within a continuous, metal matrix. A low to zero coefficient of thermal expansion material, with high thermal and electrical conductivity, results. One method for forming the composite involves coating particles of XW.sub.2 O.sub.8 with a layer of metal, then isostatically pressing the particles under conditions amenable to formation of a composite. The technique of coating, with a more malleable phase, a phase that undergoes a disadvantageous phase transformation of decomposition upon exposure to a threshold pressure at a set temperature can be applied to a variety of materials.

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patent: 5224017 (1993-06-01), Martin
patent: 5601924 (1997-02-01), Beane et al.
C. Verdon et al., "High-Temperature Reactivity in the ZrW.sub.2 O.sub.8 Cu System,"pp. 1075-1080, Scripta Materialia, vol. 36, No. 9, 1997.

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