Electrical connectors – With circuit conductors and safety grounding provision
Reexamination Certificate
1998-12-11
2001-09-04
Sircus, Brian (Department: 2839)
Electrical connectors
With circuit conductors and safety grounding provision
C174S034000, C361S818000
Reexamination Certificate
active
06283770
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
The invention relates to EMI shielding. More specifically, the invention relates to an EMI shielding clip.
(2) Background
The Federal Communications Commission (FCC) has promulgated various electromagnetic interference (EMI) emissions limitations for sources of EMI. Such sources include typical computers and other common electronic equipment. Typically, such EMI sources reside in a conductive chassis which, when grounded, blocks the EMI emissions. Gaps in the chassis such as openings for insertable modules or where the parts of the housing do not meet to form a conductive path, constitute possible leaks for EMI emissions. In an effort to satisfy EMI regulations, various shielding techniques have been developed.
FIG. 1
shows one prior art EMI D-clip. D-clip
10
can be used for shielding gaps in slide-in type modules. Typically, the ends
14
of the D-clip are inserted through two slots in the sheet metal. The natural spring force of the metal of D-clip
10
causes the arc
12
of D-clip
10
to engage an adjacent part of the chassis. Unfortunately, the deflection that occurs when the D-clip
10
engages the chassis causes the ends
14
to intrude in the area above circuit board components. This intrusion may cause the spacing required between electrical components and ground to be compromised. Additionally, to install the D-clip, it is necessary to elastically deform it so that the ends
14
can engage the slots in the sheet metal. Once the ends have engaged the slots, the natural spring forces in the D-clip
10
hold it in place. Unfortunately, this required deformation complicates installation, typically requiring both hands and possibly increasing manufacturing costs.
FIG. 2
shows a prior art perpendicular grounding clip. The perpendicular grounding clip
20
is less intrusive than the prior art D-clip but frequently fails to maintain a good contact because it was not designed for ensuring contact between parallel surfaces. The perpendicular grounding tab
24
necessitates a single orientation of installation. Detent
22
engages a slot in the module but is subject to easy dislodgment if an edge
26
is snagged during installation or deinstallation of the module. Surfaces of the dips
16
and
18
often do not provide adequate contact between the module and the chassis to provide the necessary EMI shielding.
BRIEF SUMMARY OF THE INVENTION
An apparatus for providing EMI shielding is disclosed. A conductive clip has a first jaw and a second jaw with an elbow between. The first jaw has a major surface with a detent formed on the major surface and defining a discontinuity in the major surface. The second jaw forms a contact hump disposed along the second jaw between two contact segments.
REFERENCES:
patent: 3478303 (1969-11-01), Dauser
patent: 3528050 (1970-09-01), Hindenburg
patent: 4087149 (1978-05-01), Fischer
patent: 4186981 (1980-02-01), Holton
patent: 4944692 (1990-07-01), Allina
patent: 5022873 (1991-06-01), Kollmann
patent: 5083936 (1992-01-01), Yang
patent: 5118307 (1992-06-01), Knoop et al.
patent: 5233507 (1993-08-01), Gunther
patent: 5451167 (1995-09-01), Zielinski
patent: 5453028 (1995-09-01), Grambley et al.
patent: 5746326 (1998-05-01), Hong
Eastman Scott A.
Hurst Douglas J.
Leung Jimmy Che-Kin
Blakely , Sokoloff, Taylor & Zafman LLP
Cisco Technology, Incc.
Duverne J. F.
Sircus Brian
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