Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-12-16
1998-11-17
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257721, 257714, 257712, 361695, 361687, 361697, H05K 720, H01L 2346
Patent
active
058380663
ABSTRACT:
To provide a semiconductor device heatsink that is mounted to a semiconductor device and that improves the cooling efficiency, a semiconductor device heatsink has a configuration in that the heatsink has a group of fins 1 and an air-blowing fan, the fins being formed by a large number of plates or pins on top of a base and the air-blowing fan comprising a fan rotating mechanism and a centrifugal fan 2, covers 3 and 4 being provided on the group of fins and the centrifugal fan and further an air intake aperture being provided on the centrifugal fan cover, in the direction of rotation. A centrifugal fan, rather than an axial fan as used in the past, is used, covers are provided on the heatsink and on the fan, so that air does not leak to the outside, and an air intake aperture is provided on the side of the fan cover. By doing this, heat radiating performance is improved, while making it possible to achieve a compact heatsink, which contributes to the compactness of the electronic equipment in which it is used.
REFERENCES:
patent: 5504650 (1996-04-01), Katsui et al.
patent: 5535094 (1996-07-01), Nelson et al.
patent: 5583316 (1996-12-01), Kitahara et al.
patent: 5629560 (1997-05-01), Katsui et al.
patent: 5630469 (1997-05-01), Butterbaugh et al.
patent: 5689404 (1997-11-01), Katsui
NEC Corporation
Thomas Tom
Williams Alexander Oscar
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