Geometrical instruments
Patent
1975-12-29
1977-07-26
Lake, Roy
Geometrical instruments
339275B, H05K 110
Patent
active
040378993
ABSTRACT:
An improved socket assembly is disclosed which is especially suited for use with printed circuitry. The socket is mounted on an associated printed circuit board and is adapted to receive and retain guide pins of electronic circuit modules or the like. The socket assembly further includes a non-metallic insert, such as Teflon or equivalent material, which is introduced into the socket before soldering. The insert is unaffected by the molten solder or flux and prevents entry of contaminating material into the interior of the socket during the soldering process. The insert is removable by the insertion of a module guide pin during assembly of the component mounting board.
REFERENCES:
patent: 3222632 (1965-12-01), Fuller
patent: 3268851 (1966-08-01), Mancini
patent: 3292138 (1966-12-01), Jones et al.
patent: 3601662 (1971-08-01), De Barros
patent: 3681744 (1972-08-01), Olsson
patent: 3850491 (1974-11-01), Mouissie
patent: 3865455 (1975-02-01), Berg et al.
patent: 3899232 (1975-08-01), Berg et al.
Byrnes et al.; "Printed Circuit Board Hole Addition"; IBM Tech Disclosure Bulletin, vol. 7, No. 6, Nov. 1964, p. 514.
Bicks Mark S.
Gillman James W.
Lake Roy
Motorola Inc.
Parker Margaret Marsh
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