Miscellaneous active electrical nonlinear devices – circuits – and – Specific identifiable device – circuit – or system – Integrated structure
Reexamination Certificate
2003-03-19
2004-09-14
Zweizig, Jeffrey (Department: 2816)
Miscellaneous active electrical nonlinear devices, circuits, and
Specific identifiable device, circuit, or system
Integrated structure
C327S551000
Reexamination Certificate
active
06791403
ABSTRACT:
BACKGROUND OF THE DISCLOSURE
Low cost, low weight and high performance integrated filter banks are critical components of, e.g., advanced channelized receiver and exciter modules. These require miniaturized low-cost filter technology offering excellent performance, as well as high manufacturing yield to reduce costs.
Currently the production miniature UHF, RF, and microwave circuits, especially filters, are based on “lumped element” technology where lumped capacitors (“Cs”) and inductors (“Ls”) are used to construct a filter. Such filters are expensive due, e.g., to the extensive to tuning time needed to tune each filter. Furthermore, such filters require a relatively large foot print, a high Z dimensional height and are relatively heavy.
Another approach for filter miniaturization utilizes Lanthanum Aluminate (LaAIO
3
) substrates with an assumed relative dielectric constant of &egr;
r
=24. These types of material have in the past only been used in the growth of low temperature superconducting (“LTS”) films. Such substrates are expensive, suffer from a high dislocation density, and have a rather low dielectric constant, e.g., &egr;
r
=<24. They have been limited in effectiveness, e.g., to certain space applications where small cryogenic refrigeration capabilities exists, where such distributed small filters have played an important role, albeit at a considerable cost, as discussed in “Compact Forward-Coupled Superconducting Microstrip Filters for Cellular Communication,” IEEE Transactions on Applied Superconducting, Volume 5, No. 2, 1995, pages 2656-2659.
Current Multi-Chip-Microwave-Modules are based on Alumina, Duroid or low temperature co-fired ceramic (LTCC) material. In general, the surface morphology of known thick film metallization is not very smooth due to the rather large grain size of the conductor paste.
Complex multi-layer fabrication technology generally requires a dielectric interposer-layer, sometimes called dielectric lamination layer, either as part of the microwave/RF circuit topology or as the means of physically separating the RF conducting layers from the control DC circuitry or both. Stripline RF and microwave circuits also need a lamination layer that is electrically part of the circuit dielectric layer, meaning that such layer has to have a low loss tangent (high Q) and a consistently high dielectric constant &egr;
r
, e.g., greater than or equal to 100.
SUMMARY OF THE DISCLOSURE
RF filter circuits are described which include a bottom dielectric substrate fabricated of a high dielectric material having a relative dielectric constant in a range of 30 to 100. A conductor pattern defining a circuit topology is fabricated on a surface of the substrate.
REFERENCES:
patent: 5489881 (1996-02-01), Yuda et al.
patent: 6645896 (2003-11-01), Okamoto et al.
patent: 6728092 (2004-04-01), Hunt et al.
patent: 6741148 (2004-05-01), Killen et al.
“Compact Forward-Coupled Superconducting Microstrip Filters for Cellular Communication,” IEEE Transactions on Applied Superconductivity, vol. 5, No. 2, Jun. 1995, pp 2656-2659.
Data Sheet (2 pages), REMEC Microwave Products, Surface Mount Lumped Element Filters.
Data Sheet (4 pages), 2001 Superconductor Technologies, Inc., Superfilter II, Superconductor Technologies.
Dalconzo Larry
Drapeau David J.
Nakahira Ron K.
Tayrani Reza
Alkov Leonard A.
Raytheon Company
Zweizig Jeffrey
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