Miniature power supply

Electrical transmission or interconnection systems – Miscellaneous systems – Power packs

Patent

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Details

361764, 361794, H02J 700

Patent

active

060113308

ABSTRACT:
A power supply integrated module includes a metal substrate having a surface and a body of a dielectric material, such as a glass or ceramic, mounted on and bonded to the surface of the substrate. The body is formed of a plurality of layers of the dielectric material bonded together. Areas of a conductive material and a resistive material are coated on the surfaces of the layers of the body to form passive electronic components, such as capacitors, resistors and inductors. At least one transformer is on or in the body. The transformer and passive electronic components are electrically connected by conductive interconnects on the layers of the body and vias of a conductive material extending through the layers of the body to form a power supply integrated circuit. Active electronic components, such as diodes and transistors, may also be mounted on the body and electrically connected in the power supply circuit.

REFERENCES:
patent: 5365144 (1994-11-01), Layh
International Search Report
Patent Abstracts of Japan, vol. 96, No. 3, Mar. 29, 1996 & JP, A, 07-312414 (Hitachi Ltd.) Nov. 28, 1995.
DE 4222068 C1 (ABB Patent GMBH.) Jun. 9, 1993, Claim 1, figure 1.

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