Etching a substrate: processes – Forming or treating optical article
Patent
1998-04-06
1999-10-05
Powell, William
Etching a substrate: processes
Forming or treating optical article
216 2, 216 52, 385 83, B44C 122, H01L 2100
Patent
active
059618493
DESCRIPTION:
BRIEF SUMMARY
The present invention concerns micromachined devices and in particular devices which can support one or more miniature elements in such a matter that the or each element can be positioned and held both with a very high degree of accuracy and without the risk of the element being damaged by its manipulation relative to the device in which it is held.
The invention finds particular application in the optical fibre field. However, whilst the following specification is basically directed to this field, it will be appreciated that the inventive concept is also applicable in other fields where the accurate positioning of very small elements or components is called for. An example of such an alternative field is that of biomedicine.
There has been over recent years a substantial increase in the use of fibre optics both for data communication and data manipulation. The advantages afforded by fibre optics are well-known, but in parallel with this expansion there has arisen a particular problem concerning the coupling of optical fibres either to one another or to other components such as wave guides or optoelectronic devices. For example, in order to achieve good coupling efficiency between two monomode optical fibres, or between a monomode fibre and another element, the actual coupling has to be performed with sub-micron accuracy and in a reliable and stable manner. These requirements have meant that the price of providing optical connections between optical fibres and between fibres and other components is extremely high relative to the actual cost of the elements and has accordingly provided a definite brake on the expansion of electro-optical devices.
There have been several attempts to provide accurate and relatively low cost devices for clamping optical fibres during their connections to other fibres or elements.
For example, an article entitled "Laser machining of silicon for fabrication of new microstructures" by M. Alavi, S. Buttgenbach, A Schumacher and H. J. Wagner discloses the use of laser beams for micromachining silicon substrates using the local destruction of limiting planes by laser melting followed by anisotropic etching of the disordered zones. By use of this technique microslits can be formed in the silicon substrate which can be used to locate optical elements such as optical fibres or miniature lenses.
An article in the Journal of Micromechanics and Microengineering published on 25 Jun. 1991 and entitled "LIGA-based flexible microstructures for fiber-chip coupling" represents another approach to the already described problem of optical fibre coupling. This article describes the use of deep-etch lithography in combination with a high-precision replication process to produce an element in which fibres are guided by stop faces and are pressed into engagement with the stop faces by spring elements which are fabricated as part of the element. This arrangement is said to result in precise horizontal location of the fibres. However, it is still a relatively expensive process and vertical control of the horizontally located fibres is achieved by the subsequent use of a cover plate.
In accordance with a first aspect of the present invention there is provided a miniature device for mounting one or more elements and comprising a substrate having a groove formed therein, the groove having at least one enlarged opening portion leading into the groove for coarse positioning of an element when it is initially inserted into the groove, and an overlayer extending at least partially over said groove and adapted to clamp an element when the latter has been inserted into the groove.
In accordance with a second aspect of the invention there is provided a miniature component incorporating a device as set out hereinbefore.
In accordance with a third aspect of the present invention there is provided a method of manufacturing a miniature mounting device comprising micromachining a groove in a substrate and providing an overlayer on the substrate adapted to clamp an element when the latter has been inserted into the gr
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Bostock Roger Mark
Gravesen Peter
Jones Robert
Moore David Frank
Paasch Kasper Mayntz
Cambridge Consultants Ltd.
Powell William
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