Miniature low cost modular assembly package and method of assemb

Details Miniature low cost modular assembly package and method of assemb Miniature low cost modular assembly package and method of assemb

1998-06-01

2000-10-17

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257684, 257692, 257693, H01L 2302

Patent

active

061335258

ABSTRACT:
A modular miniature circuit built entirely within the case of the module without a primary printed circuit board conventionally used as a bottom support for the circuit component. The circuit components are mounted on the inside of the case and the leads of the components are attached directly to the module's terminals, greatly reducing lead inductance. The elimination of the primary PC board results in a substantial reduction in cost and physical size and the reduction in lead lengths results in a significant enhancement of high frequency performance. The "flip chip" construction provides a flat surface for pick up by automatic assembly equipment without the added cost of a cover.

REFERENCES:
patent: 3961415 (1976-06-01), Davis, Jr.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5468994 (1995-11-01), Pendse
patent: 5656985 (1997-08-01), Lu et al.
patent: 6002168 (1999-12-01), Bellaar et al.

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