Miniature fluid-cooled heat sink with integral heater

Details Miniature fluid-cooled heat sink with integral heater Miniature fluid-cooled heat sink with integral heater

2006-01-06

2009-12-01

Karlsen, Ernest F (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C165S080400

Reexamination Certificate

active

07626407

ABSTRACT:
A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink comprising a first heat transfer portion in a first plane and a second heat transfer portion in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits, thus resulting in a three-dimensional cross-flow within the heat sink structure.

REFERENCES:
patent: 5001423 (1991-03-01), Abrami et al.
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5099910 (1992-03-01), Walpole et al.
patent: 5325052 (1994-06-01), Yamashita
patent: 5821505 (1998-10-01), Tustaniwskyj et al.
patent: 5977785 (1999-11-01), Burward-Hoy
patent: 6084215 (2000-07-01), Furuya et al.
patent: 6129973 (2000-10-01), Martin et al.
patent: 6636062 (2003-10-01), Gaasch et al.
patent: 6668570 (2003-12-01), Wall et al.
patent: 6771086 (2004-08-01), Lutz et al.
patent: 6827128 (2004-12-01), Philpott et al.
patent: 2002/0014894 (2002-02-01), Yonezawa et al.
Dr. Karl Exel, Dr. Juergen Schulz-Harder; “Water Cooled DBC Direct Bonded Copper Substrate;” 5 pgs; undated. Downloaded from the internet at www.curamik.com on Nov. 24, 2003.

Affiliated with

Also associated with

Rating

Miniature fluid-cooled heat sink with integral heater does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Miniature fluid-cooled heat sink with integral heater, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Miniature fluid-cooled heat sink with integral heater will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4128277