Mini-module with upwardly directed leads

Details Mini-module with upwardly directed leads Mini-module with upwardly directed leads

1997-07-10

1999-05-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361748, 361752, 361760, 361765, 361772, 361774, 361777, 361778, 361730, 174 50, 174 5051, 174 5054, 174 506, 174 521, 174 522, H05K 118

Patent

active

059010444

ABSTRACT:
A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.

REFERENCES:
patent: 4788626 (1988-11-01), Neidig et al.
patent: 5280413 (1994-01-01), Pai
patent: 5469333 (1995-11-01), Ellerson et al.
patent: 5699232 (1997-12-01), Neidig et al.

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