Milling apparatus

Details Milling apparatus Milling apparatus

2005-09-27

2005-09-27

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298370, C156S345300, C156S345370, C156S345190

Reexamination Certificate

active

06949174

ABSTRACT:
A milling apparatus is provided in which temperature rise of a treatment-object in milling treatment, especially of the substrate thereof, is prevented. In the apparatus, ionization mechanism2comprises casing20dhaving an opening at the center portion of the face thereof opposing to substrate5held by substrate holder6;a filament is placed at the position where the straight line drawn from the filament to substrate5is intercepted by casing20d;and electromagnets31, 32are provided around ionization mechanism2for generating a magnetic field to produce magnetic lines extending through opening20jto substrate5.

REFERENCES:
patent: 5038713 (1991-08-01), Kawakami et al.
patent: 5266146 (1993-11-01), Ohno et al.
patent: 6554974 (2003-04-01), Shiratori
patent: 6624081 (2003-09-01), Dykstra et al.
patent: 1-301870 (1989-12-01), None
patent: 2001-167479 (2001-06-01), None

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