Millimeter module package

Details Millimeter module package Millimeter module package

1992-03-16

1993-08-10

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

333 26, 257728, H01P 500, H01L 2312

Patent

active

052353001

ABSTRACT:
A module package for unpackaged millimeter wave or microwave devices allows the device to be dropped into a cavity formed in a housing and then hermetically sealed therein. Employing dielectric probe members which pass through corresponding slots in the housing to electrically interconnect the device within an application circuit allow for effective hermetic sealing and minimize electrical discontinuities and transmission losses.

REFERENCES:
patent: 4453142 (1984-06-01), Murphy
patent: 4550296 (1985-10-01), Ehrlinger et al.
patent: 4841353 (1989-06-01), Wada et al.
patent: 4901041 (1990-02-01), Pengelly
patent: 4933745 (1990-06-01), O'Shea et al.
patent: 4953001 (1990-08-01), Kaiser, Jr. et al.
patent: 4999592 (1991-03-01), Kanda et al.
patent: 5045820 (1991-09-01), Leicht et al.

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