Migration of fine lines for bodies of semiconductor materials ha

Details Migration of fine lines for bodies of semiconductor materials ha Migration of fine lines for bodies of semiconductor materials ha

1975-12-31

1976-12-21

Ozaki, G.

Metal treatment

Compositions

Heat treating

148171, 148172, 148177, 148179, 148186, 148187, 148188, 252 623GA, 252 623E, H01L 21228

Patent

active

039986624

ABSTRACT:
Metal wires of widths as small as 10 microns are successfully migrated by thermal gradient zone melting processing as a molten zone through a body of semiconductor material. The metal wires are migrated to a preselected depth without use of oxide masking and/or etched grooves when the planar orientation of the surface of the body is (100).

REFERENCES:
patent: 2813048 (1957-11-01), Pfann
patent: 3897277 (1975-07-01), Blumenfeld
patent: 3898106 (1975-08-01), Cline et al.
patent: 3899361 (1975-08-01), Cline et al.
patent: 3899362 (1975-08-01), Cline et al.
patent: 3901736 (1975-08-01), Anthony et al.
patent: 3902925 (1975-09-01), Anthony et al.
patent: 3904442 (1975-09-01), Anthony et al.
patent: 3910801 (1975-10-01), Cline et al.
patent: 3936319 (1976-02-01), Anthony et al.
patent: 3956023 (1976-05-01), Cline et al.

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