Microwave vertical interconnect through circuit with compressibl

Details Microwave vertical interconnect through circuit with compressibl Microwave vertical interconnect through circuit with compressibl

1995-06-02

1996-09-03

Gensler, Paul

Wave transmission lines and networks

Long lines

Shielded type

1741281, 333246, 333260, H01P 302, H01P 104, H01P 500

Patent

active

055527523

ABSTRACT:
A microwave frequency transmission line provides the capability of solderless interconnections between stacked microwave hybrid and printed wiring board (PWB) assemblies. A wire-like transmission line is embedded in a dielectric and placed in an open square trough. A compressible center conductor is realized by densely packing thin wire into an opening in the supporting dielectric to form the compressible center conductor. A vertical right angle bend transition uses the transmission line to interconnect between grounded coplanar waveguide (CPWG) transmission lines. This orthogonal transition uses button spring contacts, thus creating a reusable solderless vertical interconnection between the two transmission lines. This transition can operate from DC to greater than 15 GHz with good match and low loss, and allows a transition from a CPWG transmission line on a first substrate to another CPWG transmission line on a second substrate stacked above the first substrate.

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"Array Module Connector Test Program at Unisys," R. J. Kuntz, S. Williams, MCM '94 Proceedings, pp. 498-503.
"CIN::APSE Standard Products," Cinch Connector Division, 1992.
"A Modified PTFE Microwave Circuit Substrate," R. J. Bonfield, MSN & Communications Technology, Feb. 1988.

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