Microwave plug-in signal amplifying module solderment apparatus

Electricity: electrical systems and devices – Miscellaneous

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Details

174 51, 357 74, 361405, 361417, H05K 702

Patent

active

047137304

ABSTRACT:
A drop-in module in an RF frequency amplifier circuit is illustrated having space feedback between the gate and drain terminals, and having a unique mounting technique for electrically connecting the source terminals to the ground plane on the opposite side of the substrate portion of the drop-in module. The electrical connection is accomplished by using a U-shaped piece of strap metal, which is inserted in two slots with the legs or tabs of the U-shaped strap metal being bent over to be soldered to the source leads, while the bit portion of the U-shaped member is soldered to the ground plane on the opposite side of the substrate. This allows easy attachment and removal of the FET to the exposed electric circuitry, while still maintaining a definable and appropriate low impedance electrical path from the source leads to the ground plane.

REFERENCES:
patent: 4183041 (1980-01-01), Goel
patent: 4549247 (1985-10-01), Hoppe et al.
patent: 4612566 (1986-09-01), Kowata et al.

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