Microwave plasma processing apparatus and method therefor

Coating apparatus – Gas or vapor deposition – With treating means

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118723ME, 118723MA, 118723MR, 156345, 20429838, 438726, 438727, 438728, 427575, C23C 1600

Patent

active

058039759

ABSTRACT:
For generating uniform high-density plasma over a large area with a low power thereby achieving high-quality plasma process at a high speed even at a low temperature, there is provided a microwave plasma processing apparatus comprising a plasma generation chamber having a periphery separated from the ambient air by a dielectric member, microwave introduction means utilizing an endless annular wave guide tube provided around the plasma generation chamber and provided with plural slots, a processing chamber connected to the plasma generation chamber, support means for a substrate to be processed provided in the processing chamber, gas introduction means for the plasma generation chamber and the processing chamber, and evacuation means for the plasma generation chamber and the processing chamber, wherein the circumferential length L.sub.g of the endless annular wave guide tube, the wavelength .lambda..sub.g of the microwave in the endless annular wave guide tube, the circumferential length L.sub.s of the dielectric member and the wavelength .lambda..sub.s of the surface wave propagating in the dielectric material substantially satisfy a relationship:

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patent: 5487875 (1996-01-01), Suzuki
patent: 5538699 (1996-07-01), Suzuki
patent: 5646489 (1997-07-01), Kakehi et al.

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