Microwave planar sensor using PCB cavity packaging process

Details Microwave planar sensor using PCB cavity packaging process Microwave planar sensor using PCB cavity packaging process

2008-12-11

2009-12-29

Sotomayor, John B (Department: 3662)

Communications: directive radio wave systems and devices (e.g.,

Presence detection only

By motion detection

C342S114000, C342S175000

Reexamination Certificate

active

07639173

ABSTRACT:
A microwave planar sensor for detecting the presence and movement of a target in a detection area, including a microwave board and a support board. The microwave board includes an oscillator/mixer layer, an antenna layer and a ground layer sandwiched between the oscillator/mixer layer and the antenna layer, when the oscillator/mixer layer and the antenna layer are bonded together. The oscillator/mixer layer includes an oscillator configured to generate at least one microwave signal and a signal mixer electrically coupled to the oscillator. The signal mixer is configured to combine a microwave signal generated by the oscillator and a reflected signal reflected by the target in the detection area, thereby generating an intermediate frequency signal having a Doppler frequency. The antenna layer includes a transmit antenna coupled to the oscillator for transmitting a microwave signal generated by the oscillator into the detection area and a receive antenna coupled to the signal mixer for receiving a reflected signal reflected by the target. The support board includes a top surface bonded to the microwave board through a first metal layer coated on the top surface. The support board further includes a continuous cavity extending from the top surface for accommodating the oscillator and the mixer of the oscillator/mixer layer, the surface of the cavity coated with a second metal layer.

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