Microwave/millimeter wave circuit structure with discrete flip-c

Details Microwave/millimeter wave circuit structure with discrete flip-c Microwave/millimeter wave circuit structure with discrete flip-c

1995-07-07

1997-05-13

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

22818022, H01L 2160

Patent

active

056292414

ABSTRACT:
A microwave/millimeter wave circuit structure supports discrete circuit elements by flip-chip mounting to an interconnection network on a low cost non-ceramic and non-semiconductor dielectric substrate, preferably Duroid. The necessary precise alignment of the circuit elements with contact pads on the substrate network required for the high operating frequencies is facilitated by oxidizing the interconnection network, but providing the contact pads from a non-oxidizable material to establish a preferential solder bump wetting for the pads. Alternately, the contact bumps on the flip-chips can be precisely positioned through corresponding openings in a passivation layer over the interconnection network. For thin circuit substrates that are too soft for successful flip-chip mounting, stiffening substrates are laminated to the circuit substrates. In a self-contained antenna application in which two of the circuit substrates are laminated together, with an antenna on one side and circuitry on the other side, a metallic ground plane between the substrates also serves a stiffening function.

REFERENCES:
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patent: 5074947 (1991-12-01), Estes et al.
patent: 5227812 (1993-07-01), Watanabe et al.
patent: 5346857 (1994-09-01), Scharr et al.
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patent: 5404006 (1995-04-01), Schaffner et al.
patent: 5498575 (1996-03-01), Onishi et al.
patent: 5514912 (1996-05-01), Ogashiwa
H. Sakai et al., "A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology", IEEE MTT-S Digest, 1994, pp. 1763-1766.

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