Microwave method of perforating a polymer film

Details Microwave method of perforating a polymer film Microwave method of perforating a polymer film

1985-01-14

1987-05-05

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562724, 156276, 264 26, 264132, 264154, 219 1055M, 219 1055R, B32B 3118

Patent

active

046629696

ABSTRACT:
A method of forming perforations in polymer film includes the steps of forming a conductive film pattern on the film preferably in a bow tie shape using a material with a moderate resistivity and applying a microwave field across the film for a few seconds whereupon sufficient electrical energy is dissipated in the conductive spot to perforate the polymer. This method is operative even when the polymer film is laminated between layers of other dielectric material prior to the microwave processing.

REFERENCES:
patent: 2768923 (1956-10-01), Kepple
patent: 3574021 (1971-04-01), Van Buskirk
patent: 3964951 (1976-06-01), Kremer et al.
patent: 4210674 (1980-07-01), Mitchell
patent: 4347844 (1982-09-01), Ohki
patent: 4419373 (1983-12-01), Oppermann
patent: 4511520 (1985-04-01), Bowen

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