Microwave integrated circuit substrate including metal filled vi

Details Microwave integrated circuit substrate including metal filled vi Microwave integrated circuit substrate including metal filled vi

1988-09-29

1990-05-15

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428472, 428901, 156155, 295921, 29825, 29852, B32B 300

Patent

active

049257234

ABSTRACT:
The present invention is directed to a microwave integrated circuit formed on a substrate having via holes for either electrical grounding or heat dissipation or both and more particularly to a substrate including via holes which are filled with metal.

REFERENCES:
patent: 3205298 (1965-09-01), Kolt
patent: 3562009 (1971-02-01), Cranston et al.

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