Wave transmission lines and networks – Long line elements and components – Strip type
Patent
1991-03-25
1992-08-04
Gensler, Paul
Wave transmission lines and networks
Long line elements and components
Strip type
333247, H01P 308, H05K 706
Patent
active
051362716
ABSTRACT:
An integrated circuit package having enhanced mounting density is provided. The package includes a microwave integrated circuit and a drive circuit therefor, both accommodated in a casing having a layer structure made of a multi-layer ceramic. Through holes in a multi-layer ceramic are utilized for wiring so that the number of conductive tracks provided on the same plane can be reduced and the mounting density can be enhanced. The integrated circuit and the drive circuit are disposed in the casing vertically with respect to each other to reduce the overall longitudinal dimension of the package and enhance mounting density. High frequency connectors adapted to feed high frequency signals to the integrated circuit, and connector pins adapted to supply external control signals and a power signal to the drive circuit, are connected on the underside surface of the casing. A through hole of a horse shoe type is formed through one of the dielectric members, and metallic material is filled therein to provide an external conductor for coaxial tracks. Alternatively, this through hole can be processed by plating or the like to improve the electrical characteristics.
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Inami Kazuyoshi
Kawano Hazime
Nishioka Yasuhiko
Gensler Paul
Mitsubishi Denki & Kabushiki Kaisha
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