Microwave IC package

Details Microwave IC package Microwave IC package

1992-12-24

1994-03-15

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

29832, 29841, 257676, 257728, 333246, 333247, H01P 500

Patent

active

052948978

ABSTRACT:
A surface mountable microwave IC package includes a dielectric substrate; a ground conductor disposed on a front surface of a dielectric substrate on which a microwave IC chip is disposed and grounded; and a transmission line for connecting the microwave IC chip to a coplanar line on a package substrate outside the microwave IC package. The upper coplanar line is disposed on the front surface of the dielectric substrate and includes the ground conductor on which the IC chip is disposed. The lower coplanar line is disposed on the rear surface of the dielectric substrate. The intermediate coplanar line penetrates through the dielectric substrate and connects the upper coplanar line to the lower coplanar line. Therefore, the microwave transmission path from the package substrate to the IC chip is a coplanar transmission line so that a continuous transmission mode is maintained through the microwave transmission path. As a result, reflection of high frequency signals caused by the mismatching of characteristic impedances in the microwave transmission line is significantly reduced.

REFERENCES:
patent: 3303439 (1967-02-01), Fulp
patent: 4543544 (1985-09-01), Ziegner
patent: 4600907 (1986-07-01), Grellman et al.
patent: 4626805 (1986-12-01), Jones
patent: 4806892 (1989-02-01), Thorpe et al.
patent: 5229727 (1993-07-01), Clark et al.
patent: 5235208 (1993-08-01), Katoh

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