Wave transmission lines and networks – Long lines – Strip type
Patent
1982-10-19
1985-04-23
Gensler, Paul
Wave transmission lines and networks
Long lines
Strip type
333246, H01P 308
Patent
active
045132666
ABSTRACT:
The invention is connected with a microwave structure, and particularly with the improvement of a microwave circuit of the three plate construction having a plurality of independent circuits formed in an inner level that is sandwiched by two dielectric conductor boards having grounded conductive layers on their outer surfaces, wherein a plurality of through holes are formed to penetrate through the dielectric boards between the neighboring circuits and extending between the conductive layers on the outer surfaces of the boards, the inner surfaces of the through holes being metallized to connect the grounded conductive layers to provide a ground shield between the neighboring circuits.
REFERENCES:
patent: 2812501 (1957-11-01), Sommers
patent: 3093805 (1963-06-01), Osifchin et al.
patent: 3768048 (1973-10-01), Jones, Jr. et al.
patent: 3895435 (1975-07-01), Turner et al.
"A 100 ns 5 V Only 64K.times.1 MOS Dynamic RAM", J. Y. Chan et al, IEEE Journal Solid-State Circuits, vol. SC-15, pp. 839-846, Oct. 1980.
"A 5-V Only 16-kbit Stacked-Capacitor MOS RAM", M. Koyanagi et al, IEEE Journal, Solid State Circuits, vol. SC-15, No. 4, pp. 661-666, Aug. 1980.
"64-k RAM with Single Supply Could Be the Standard for Future Design", Sam Young, Electronic Design 13, pp. 58-64, Jun. 21, 1979.
Gensler Paul
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Microwave ground shield structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microwave ground shield structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave ground shield structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-38599