Microwave food package and method

Electric heating – Microwave heating – Cookware

Reexamination Certificate

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Details

C219S729000

Reexamination Certificate

active

06259079

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to the field of microwave heating of foodstuffs, in particular to packaging designed for influencing the heating of the foodstuff as it is irradiated with microwave energy. More particularly, the present invention relates to the use of both evanescent and propagating microwave energy to control heating of foodstuffs.
BACKGROUND OF THE INVENTION
With respect to microwave foods, it is often desirable that the microwave heating be controlled in order to prevent overheating of the food. One example is microwave heating and popping of popcorn. If popped kernels are subjected to prolonged microwave heating, scorching occurs. Currently, microwave popcorn is packaged in flexible paper bags. Embedded in the popcorn bag is a susceptor used to absorb microwave energy and aid popcorn heating and popping. Typically in packaging microwave popcorn, a slurry including popcorn kernels are located on top of the susceptor, the bag is folded over itself to a compact size. When the bag is placed in the microwave oven, instructions typically call for at least partial unfolding of the bag and placing the bag on a microwave transparent shelf or floor of the oven with the susceptor below the popcorn. When the popcorn bag is heated in the microwave oven, steam or water vapor from the popping popcorn causes the bag to further unfold and inflate. With the current bag designs, popped kernels are unprotected from microwave irradiation after popping. When heated above about 210° C., popped kernels begin to scorch. The present invention overcomes this shortcoming of prior art popcorn bags (and other microwave-related food packages) by providing a bag or package that initially exposes the popcorn (or other food load) to a controlled combination of both propagating and non-propagating (evanescent) microwave irradiation to pop the kernels or otherwise heat the food load and thereafter reduces the microwave irradiation to the bulk of the popped kernels (or other heated food load), to reduce the possibility of scorching (and other undesirable results of overheating) that would otherwise occur. When a popcorn load is referred to herein, it is to be understood that it generally refers to a load that includes a popcorn kernel hybrid engineered for desired agronomic and microwave popping properties and consistent with generally available major commercially available microwave popcorn offerings, together with a butter type slurry having major constituents of soybean oil, salt, colorings, flavorings and the like. These components combine (in a typical load) to a weight of approximately 100 grams with about 80% or more (by weight) being the popcorn kernels themselves.


REFERENCES:
patent: 3219460 (1965-11-01), Brown
patent: 4080524 (1978-03-01), Greenfield et al.
patent: 4081646 (1978-03-01), Goltsos
patent: 4144435 (1979-03-01), Clark et al.
patent: 4144438 (1979-03-01), Gelman et al.
patent: 4190757 (1980-02-01), Turpin et al.
patent: 4196331 (1980-04-01), Leveckis et al.
patent: 4204105 (1980-05-01), Leveckis et al.
patent: 4228334 (1980-10-01), Clark et al.
patent: 4268738 (1981-05-01), Flautt, Jr. et al.
patent: 4656325 (1987-04-01), Keefer
patent: 4676857 (1987-06-01), Scharr et al.
patent: 4689458 (1987-08-01), Levendusky et al.
patent: 4703148 (1987-10-01), Mikulski et al.
patent: 4734288 (1988-03-01), Engstrom et al.
patent: 4777053 (1988-10-01), Tobelmann et al.
patent: 4810844 (1989-03-01), Anderson
patent: 4865921 (1989-09-01), Hollenberg et al.
patent: 4866234 (1989-09-01), Keefer
patent: 4870233 (1989-09-01), McDonald et al.
patent: 4888459 (1989-12-01), Keefer
patent: 4908246 (1990-03-01), Fredricks et al.
patent: 4915780 (1990-04-01), Beckett
patent: 4927991 (1990-05-01), Wendt et al.
patent: 4962000 (1990-10-01), Emslander et al.
patent: 4972059 (1990-11-01), Wendt et al.
patent: 4985606 (1991-01-01), Faller
patent: 5006684 (1991-04-01), Wendt et al.
patent: 5012068 (1991-04-01), Anderson
patent: 5038009 (1991-08-01), Babbitt
patent: 5039364 (1991-08-01), Beckett et al.
patent: 5059279 (1991-10-01), Wilson
patent: 5081330 (1992-01-01), Brandberg et al.
patent: 5117078 (1992-05-01), Beckett
patent: 5124519 (1992-06-01), Roy et al.
patent: 5164562 (1992-11-01), Huffman et al.
patent: 5185506 (1993-02-01), Walters
patent: 5254821 (1993-10-01), Walters
patent: 5256846 (1993-10-01), Walters
patent: 5260537 (1993-11-01), Beckett
patent: 5300746 (1994-04-01), Walters et al.
patent: 5331135 (1994-07-01), Ovadia
patent: 5354973 (1994-10-01), Beckett
patent: 5391430 (1995-02-01), Fabish et al.
patent: 5412187 (1995-05-01), Walters et al.
patent: 5468939 (1995-11-01), MacLean, IV
patent: 5489766 (1996-02-01), Walters et al.
patent: 5519195 (1996-05-01), Keefer et al.
patent: 5928555 (1999-07-01), Kim et al.
patent: 2098184 (1997-06-01), None
Article, “Better susceptor heats up for microwave pizza”, Packaging Digest, Aug. 1995.
Article, “Historical and Recent Attempts to Solve Microwave Heating Problems with Packaging”, vol. 13, No. 1—Summer 1992.
Article, “A Microwave Oven Model, Examples of Microwave Heating Computations”, Microwave World, vol. 19, No. 1—Summer 1998.
Article, “You Can Use Metal In a Microwave Oven”, Microwave World, vol. 13, No. 1—Summer 1992.
Classical Electrodynamics, John David Jackson, Second Edition, 1962, 1975; Chapter 8 “Wave Guides and Resonant Cavities”, pp. 335-375; Sep. 9.11 “Simple Radiating Systems, Scattering, and Diffraction”, pp. 438-441.
Dielectrics and Waves, Arthur R. Von Hippel, 1954, “Guided Waves”, pp. 67-73.
Microwave Cooking and Processing, Charles R. Buffler, PhD, 1993, Chapter 7 “Packaging Containers, and Susceptors”, pp. 84-95.

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